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Zijian Zhang（张子健）

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Zijian Zhang, Ph.D. student
Department of Electrical Engineering
Tsinghua University
Room 8-212, Rohm Building, Tsinghua University, Beijing 100084, China
Email: zhangzj20@tsinghua.edu.cn

[Google Scholar] [ResearchGate] [IEEE Xplore]

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Welcome

Zijian Zhang received the B.E. degree in electronic engineering from Tsinghua University, Beijing, China, in 2020. He is currently working toward the Ph.D. degree in electronic engineering from Tsinghua University, Beijing, China. His research area is Beyond Massive MIMO for future 6G wireless communications, involving the aspects of hardware architecture designs, signal modeling, performance analyses, algorithm designs, and prototype developments. He is also an amateur in wireless localization and robotics.

Zijian Zhang has published more than 30 papers in many top SCI journals and EI conferences (including IEEE JSAC, IEEE TSP, IEEE TWC, IEEE TCOM, IEEE TITS, IEEE WCL, IEEE CL, IEEE ICC, IEEE GLOBECOM, etc.) in the field of Beyond Massive MIMO. Up to now, he has obtained over 1400 Google Scholar Citations. Among these papers, 1 article was selected as the ESI Top 0.1% Hot Paper with over 600 citations, and 3 articles were selected as the ESI Top 1% Highly Cited Papers. In addition, he has authored two chapters in academic books, and he applied for 14 Chinese and International patents. He has also several journal papers under review. He was listed as a World's Top 2% Scientist in 2023.

Education

  • B.E. in Electrical Engineering, Tsinghua University, Beijing, China, Sep. 2016 - Jun. 2020

  • Second Bachelor Degree in Economics, Tsinghua University, Beijing, China, Sep. 2016 - Jun. 2020

  • Ph.D. in Electrical Engineering, Tsinghua University, Beijing, China, Sep. 2020 - Present

Research Interests

  • Statistical signal processing, matrix analysis, convex optimization

  • Massive MIMO, holographic MIMO (H-MIMO)

  • Reconfigurable intelligent surface (RIS), large intelligent surface (LIS)

  • Network localization, navigation

Academic Services

  • TPC member: IEEE GLOBECOM (2022, 2024), IEEE VTC (2022 Fall), IEEE WCNC (2024, 2025).

  • Journal reviewer: IEEE JSAC, IEEE TSP, IEEE TCOM, IEEE TWC, IEEE COMMAG, IEEE VTM, etc.

  • Conference reviewer: IEEE ICC, IEEE GLOBECOM, IEEE VTC, IEEE WCNC, IEEE SPAWC, etc.

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